High-Speed Multilayer PCB Layout
Impedance-matched differential routing for high-frequency interfaces with blind, buried, and micro-via architectures maintaining strict IPC Class 3 and CE/FCC compliance.
- Layer Count2 to 16 Layers (FR4 / Rogers)
- Controlled Impedance±5% Tolerance (Single/Diff)
- High-Speed RoutingUSB 3.0, PCIe, MIPI, 1GbE
- Via ArchitecturesBlind, Buried & 0.1mm Micro-vias
- Thermal ManagementThermal Vias & Metal Core PCB